Innovative double-sided grinding machine: Solve sheet processing problems, improve product accuracy and efficiency

double-sided grinding machine, as a key equipment for wafer processing, its main function is to improve the end face accuracy of the workpiece. In the current industrial production, the lower disk device of the double-sided grinder is mainly divided into two types: one is that the lower disk is directly fixed on the machine tool, and the other is that the upper disk is driven by the motor. However, both of these methods have some problems in the actual grinding process.

First of all, for the double-sided grinder with the lower disk fixed, when the upper disk is driven by the motor to do positive rotation, the lower disk will cause greater friction between the upper and lower disks due to fixed immobility. This friction creates local pressure on the workpiece, which may cause the workpiece to break, thereby increasing the scrap rate of the product.

The other way is that the upper mill is driven by the motor to do the forward rotation, and the lower mill is driven by the motor to do the reverse. Although this method can reduce the friction between the upper and lower grinding disks, in the early start-up of the double-sided grinder, due to the large acceleration of the upper grinding disk, it may still cause the problem of workpiece fragmentation.

In response to these problems, we carried out a series of in-depth research and technical innovation, and finally developed a new type of Double-sided grinding machine. The double-sided grinding machine mainly comprises a machine shell, a lower grinding disk, an upper grinding disk and a drive. Among them, the lower grinding disc device is arranged in the device groove in the machine tool housing and is rotated with the device groove. The advantage of this design is that when the upper disk is driven by the motor to do a positive rotation, the lower disk can rotate with the upper disk, thereby reducing the force of the upper and lower disks on the workpiece.

This design can not only effectively reduce the scrap rate of products and improve production efficiency, but also make the double-sided grinder more stable when starting and stopping due to the rotation of the lower grinding disc and the device groove, and further improve the processing quality of products.

In summary, this new double-sided grinding machine provided by us solves the problems existing in the prior art and improves the processing accuracy of the workpiece and the production efficiency of the product. This design provides a new solution for the processing of wafer products, which has high practical value and broad market prospects.